Skip to main content Skip to navigation

Publications

View Publications

View Journals        View Books and Chapters        View Conferences        View Other

Journals


  • Hu, Borong, Ortiz Gonzalez, Jose Angel, Ran, Li, Ren, Hai, Zeng, Zheng, Lai, Wei, Gao, Bing, Alatise, Olayiwola M., Lu, Hua, Bailey, Christopher, Mawby, P. A. (Philip A.). 2017. Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4), pp. 727-737, View
  • Lai, Wei, Chen, Mingyou, Ran, Li, Xu, Shengyou, Jiang, Nan, Wang, Xuemei, Alatise, Olayiwola M., Mawby, P. A.. 2017. Experimental investigations on the effects of narrow junction temperature cycles on die-attach solder layer in an IGBT module. IEEE Transactions on Power Electronics, 32 (2), pp. 1431-1441, View
  • Ortiz Gonzalez, Jose Angel, Alatise, Olayiwola M., Hu, Ji, Ran, Li, Mawby, P. A. (Philip A.). 2017. An investigation of temperature sensitive electrical parameters for SiC power MOSFETs. IEEE Transactions on Power Electronics, 32 (10), pp. 7954 -7966, View
  • Gao, Bing, Yang, Fan, Minyou, Chen, Ran, Li, Ullah, Irfan, Xu, Shengyou, Mawby, P. A. (Philip A.). 2017. A temperature gradient based Condition Estimation Method for IGBT Module. IEEE Transactions on Power Electronics, 32 (3), pp. 2227 -2242, View
  • Li, Hui, Liao, Xinglin, Zeng, Zheng, Hu, Yaogang, Li, Yang, Liu, Shengquan, Ran, Li. 2017. Thermal coupling analysis for a multi-chip paralleled IGBT module in a doubly fed wind turbine power converter. IEEE Transactions on Energy Conversion, 32 (1), pp. 80-90, View
  • Ortiz Gonzalez, Jose Angel, Alatise, Olayiwola M., Aliyu, Attahir, Rajaguru, Pushparajah, Castellazzi, Alberto, Ran, Li, Mawby, P. A. (Philip A.), Bailey, Chris. 2017. Evaluation of SiC schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10), pp. 8213 -8223, View
  • Tang, Yuan, Ran, Li, Alatise, Olayiwola M., Mawby, P. A. (Philip A.). 2016. A model assisted testing scheme for modular multilevel converter. IEEE Transactions on Power Electronics, 31 (1), pp. 165-176, View
  • Tang, Yuan, Chen, Minjie, Ran, Li. 2016. A compact MMC submodule structure with reduced capacitor size using the stacked switched capacitor architecture. IEEE Transactions on Power Electronics, 31 (10), pp. 6920-6936, View
  • Ortiz Gonzalez, Jose Angel, Aliyu, A. M., Alatise, Olayiwola M., Castellazzi, A., Ran, Li, Mawby, P. A. (Philip A.). 2016. Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules. Microelectronics Reliability, 64, pp. 434-439, View
  • Tang, Yuan, Ran, Li, Alatise, Olayiwola M., Mawby, P. A.. 2016. Improved testing capability of the model assisted testing scheme for modular multilevel converter. IEEE Transactions on Power Electronics, 31 (11), pp. 7823-7836, View
  • Lai, Wei, Mawby, P. A. (Philip A.), Qin, Han, Alatise, Olayiwola M., Xu, Shengyou, Chen, Minyou, Ran, Li. 2016. Study on the lifetime characteristics of power modules under power cycling conditions. IET Power Electronics, 9 (5), pp. 1045-1052, View
  • Hu, Ji, Alatise, Olayiwola M., Ortiz Gonzalez, Jose Angel, Alexakis, Petros, Ran, Li, Mawby, P. A.. 2016. Robustness and balancing of parallel connected power devices : SiC vs. CoolMOS. IEEE Transactions on Industrial Electronics, 63 (4), pp. 2092-2102, View
  • Tang, Yuan, Ran, Li, Alatise, Olayiwola M., Mawby, P. A. (Philip A.). 2016. Capacitor selection for modular multilevel converter. IEEE Transactions on Industry Applications, 52 (4), pp. 3279 -3293, View
  • Lai, Wei, Chen, Mingyou, Ran, Li, Alatise, Olayiwola M., Xu, Shengyou, Mawby, P. A. (Philip A.). 2016. Low ?Tj stress cycle effects in IGBT power module die-attach lifetime modelling. IEEE Transactions on Power Electronics, 31 (9), pp. 6575-6585, View
  • Bonyadi, Roozbeh, Alatise, Olayiwola M., Jahdi, Saeed, Hu, Ji, Ortiz Gonzalez, Jose Angel, Ran, Li, Mawby, Philip A.. 2015. Compact electro-thermal reliability modelling and experimental characterisation of bipolar latch-up in SiC and CoolMOS Power MOSFETs. IEEE Transactions on Power Electronics, View
  • Jahdi, Saeed, Alatise, Olayiwola M., Ran, Li, Mawby, P. A. (Philip A.). 2015. Accurate analytical modeling for switching energy of PiN diodes reverse recovery. IEEE Transactions on Industrial Electronics, 62 (3), pp. 1461-1470, View
  • Jahdi, Saeed, Alatise, Olayiwola M., Bonyadi, Roozbeh, Alexakis, Petros, Fisher, Craig A., Ortiz Gonzalez, Jose Angel, Ran, Li, Mawby, P. A. (Philip A.). 2015. An analysis of the switching performance and robustness of power MOSFETs body diodes : a technology evaluation. IEEE Transactions on Power Electronics, Volume 30 (Number 5), pp. 2383-2394, View
  • Hu, Ji, Alatise, Olayiwola M., Ortiz Gonzalez, Jose Angel, Bonyadi, Roozbeh, Ran, Li, Mawby, P. A.. 2015. The effect of electrothermal nonuniformities on parallel connected SiC power devices under unclamped and clamped inductive switching. IEEE Transactions on Power Electronics, 31 (6), pp. 4526-4535, View
  • Jahdi, Saeed, Alatise, Olayiwola M., Ortiz Gonzalez, Jose Angel, Bonyadi, Roozbeh, Ran, Li, Mawby, P. A. (Philip A.). 2015. Temperature and switching rate dependence of crosstalk in Si-IGBT and SiC power modules. IEEE Transactions on Industrial Electronics, 63 (2), pp. 849-863, View
  • Jahdi, Saeed, Alatise, Olayiwola M., Ran, Li, Mawby, P. A. (Philip A.). 2015. Analytical modeling of switching energy of silicon carbide Schottky diodes as functions of dIDS/dt and temperature. IEEE Transactions on Power Electronics, 30 (6), pp. 3345-3355, View
  • Bonyadi, Roozbeh, Alatise, Olayiwola M., Jahdi, Saeed, Hu, Ji, Ortiz Gonzalez, Jose Angel, Ran, Li, Mawby, P. A.. 2015. Compact electrothermal reliability modeling and experimental characterization of bipolar latchup in SiC and CoolMOS power MOSFETs. IEEE Transactions on Power Electronics, 30 (12), pp. 6978-6992, View
  • Jahdi, Saeed, Alatise, Olayiwola M., Alexakis, Petros, Ran, Li, Mawby, P. A. (Philip A.). 2015. The impact of temperature and switching rate on the dynamic characteristics of silicon carbide schottky barrier diodes and MOSFETs. IEEE Transactions on Industrial Electronics, Volume 62 (Number 1), pp. 163-171, View
  • Zaggout, Mahmoud, Ran, Li, Tavner, Peter J., Crabtree, Christopher. 2014. Detection of rotor electrical asymmetry in wind turbine doubly-fed induction generators. IET Renewable Power Generation, Volume 8 (Number 8), pp. 878-886, View
  • Jahdi, Saeed, Alatise, Olayiwola M., Fisher, Craig A., Ran, Li, Mawby, P. A. (Philip A.). 2014. An evaluation of silicon carbide unipolar technologies for electric vehicle drive-trains. IEEE Journal of Emerging and Selected Topics in Power Electronics, Volume 2 (Number 3), pp. 517-528, View
  • Alexakis, Petros, Alatise, Olayiwola M., Hu, Ji, Jahdi, Saeed, Ran, Li, Mawby, P. A.. 2014. Improved electrothermal ruggedness in SiC MOSFETs compared with silicon IGBTs. IEEE Transactions on Electron Devices, Volume 61 (Number 7), pp. 2278-2286, View
  • Ahmed, Ashraf, Ran, Li, Moon, Sol, Park, Joung-Hu. 2013. A fast PV power tracking control algorithm with reduced power mode. IEEE Transactions on Energy Conversion, 28 (3), pp. 565-575, View
  • Xiang, Dawei, Ran, Li, Tavner, Peter, Yang, Shaoyong, Bryant, Angus, Mawby, P. A. (Philip A.). 2012. Condition monitoring power module solder fatigue using inverter harmonic identification. IEEE Transactions on Power Electronics, Volume 27 (Number 1), pp. 235-247, View
  • Xu, Z. Y., Yan, X. Q., Ran, Li, Zhang, X.. 2012. Fault phase selection scheme of EHV/UHV transmission line protection for high-resistance faults. IET Proceedings - Generation, Transmission and Distribution, 6 (11), pp. 1180-1187, View
  • Ran, Li, Mawby, P. A. (Philip A.), McKeever, Paul, Konaklieva, Syliva. 2012. Condition monitoring of power electronics for offshore wind. Engineering & Technology Reference, View
  • Parker, Max A., Ran, Li, Finney, Stephen J.. 2012. Distributed control of a fault-tolerant modular multilevel inverter for direct-drive wind turbine grid interfacing. IEEE Transactions on Industrial Electronics, 60 (2), pp. 509-522, View


Next       

Page 1 of 2