We have a fully comprehensive electron microscopy facility within WMG ranging from Desktop Scanning Electron Microscopy to Scanning/Transmission Electron Microscopy. Our high-resolution Scanning Electron Microscopes (SEM) are suitable for microscale analysis of materials, this extends into chemical compositional analysis through Energy-Dispersive X-ray Spectroscopy (EDS). Electron Backscatter Diffraction (EBSD) can also be acquired allowing for the evaluation of the texture and crystallographic orientation of each grain within a sample. In situ testing can be undertaken through the application of either a high temperature or mechanical stage.
An extension of SEM arises from the incorporation of a Focused Ion Beam (FIB), known as a FIBSEM. This allows for sample manipulation and modification through material deposition: Pt, C and Si, cutting and milling. This provides a range of alternative applications predominantly FIB lift-out samples, SliceNView 3D tomography and microstructure feature analysis such as micro-porosity and cracking. FIB lift-outs are prepared by cutting thin, site specific, sections from bulk materials. Once prepared the lift-outs can be analysed using Transmission Electron Microscopy (TEM). Other applications are Secondary Ion Mass Spectroscopy (SIMS) and low-vacuum environmental (E-SEM).
Transmission Electron Microscopy (TEM) and Scanning TEM (STEM) allow for imaging at the nanoscale, with sub-angstrom resolution. Conventional bright field TEM, electron diffraction, High-Angle Annular Dark Field (HAADF) and bright field STEM imaging is readily available through the use of pre-set FEG registers. The application of the Super-X quad EDX detector results in high resolution chemical mapping to the atomic scale. 3D reconstructions can also be achieved through the use of a high-tilt tomography holder. Magnetic domains can be imaged using Lorentz microscopy and acquired in 4k with the high performance Ceta camera.