The Warwick Cleanroom houses a suite of cutting-edge equipment for semiconductor fabrication and research. The facility is equipped with state-of-the-art tools and techniques that ensure precision and high-quality results, including lithography, etching, deposition, oxidation, annealing and testing capabilities.
Lithography uses a thin beam of UV light to transfer intricate patterns onto wafers (a thin slice of semiconductor material) to determine the layout of components. The Warwick Cleanroom provides access to a range of sophisticated lithography tools, ensuring clients can achieve high-precision nanoscale features.
Tools like the Suss Microtec mask aligners ensure high resolution and accuracy, while the combination of manual and automated systems enhances flexibility and efficiency in processing different substrate types and sizes.
Lithography Area:
40 m², illuminated with yellow light to support photoresist use. (White light emits trace levels of UV, which can affect samples)
Supports both positive and negative photoresists, including bi-level resist processes.
Coating:
Spin 150 Manual Resist Spin Coater: Handles substrates from 0.5 cm² to 6" diameter.
Laurell WS-650Mz Auto Dispense Spin Coater: Accommodates substrates from 2" to 6" diameter.
Exposure:
Suss Microtec MJB3 Manual Mask Aligner: Supports substrates from 0.5 cm² to 3" diameter with a resolution of 1.5 µm.
Suss Microtec MA/BA8 Mask Aligner with SCIL Adaptation: Handles substrates from 1 cm² to 8" diameter with a resolution of 0.75 µm. SCIL processing enables feature definition down to 50 nm on 2" and 3" diameter substrates.
Develop:
Manual Glassware Development: Suitable for small and irregular substrates.
Laurell EDC-650Hz Spin Developer: Designed for substrates of 2" to 3" diameter.
Etching and wet processing allows the creation of precise features and connections through plasma, laser, or acid chemistries, selectively removing layers to achieve microstructures.
Our versatile range of chemistries and equipment cater to a wide range of processing requirements.
Etching and Wet Processing Area:
Capabilities: Equipped for both acid (wet etch) and plasma (dry etch) processes, as well as wafer cleaning.
Wet Etching:
Chemistries: Full range of acid chemistries for etching SiC, Si, InSb substrates, metals, and dielectrics.
Equipment: Hot plates and water baths for warm and hot acid processes.
Dry Etching:
Corial 200IL ICP Dry Etch System: Uses fluorinated and chlorinated chemistry with laser endpoint detection.
L&B Semiconductor Soln Ltd Oxygen Plasma Ash System: For various dry etching needs.
Other Wet Processing:
Extracted Wet Stations: Two for acid etching (including hot acid processes) and one for alkaline processing. Includes Type 1 (18.2MΩ) DI water in all stations.
Extracted Cabinets: Two for solvent cleaning and lift-off processes.
Advanced deposition capabilities provide users with high-quality dielectric and metal film deposition equipment for precise and reliable fabrication. The facility supports a wide range of standard and customisable deposition materials.
Dielectric Deposition:
Ultratech Fiji Plasma-Enhanced ALD System: Standard precursors include Al, Si, Zn, Hf. Co-reagents: H2O, O2 plasma, O3, N2 plasma.
Tetreon (Thermco) LPCVD System: Uses TEOS chemistry for high-quality oxide film deposition (10-4000 nm).
SVS 8 Pocket Electron Beam Evaporator: Includes ion beam gun for in-situ etch. Standard dielectrics: Al2O3, MgO, SiO2.
Metal Deposition:
SVS 8 Pocket Electron Beam Evaporator: Includes ion beam gun for in-situ etch. Standard metals: Ni, Al, Ti, Cr, Pd, Ag, Au, W, Pt. More metals upon request.
Annealing is the process of growing a thin layer of silicon dioxide on top of a wafer through a tightly controlled oxidation process to protect against contamination.
The Cleanroom’s advanced equipment enables rapid and precise annealing, offering both precision and versatility in thermal processing. Programmable furnaces allow precise control over gas flow and temperature profiles, accommodating various substrates and process requirements.
Thermal Oxidation:
Carbolite CTF18300 Tube Furnace: Oxidizing atmosphere, gas flow up to 10 SLM, temperature up to 1750°C, supports substrates up to 75 mm.
Hitech Oxidation Furnace: Programmable flow (0.1 to 10 SLM), temperatures up to 1700°C (inert) and 1400°C (oxidizing).
Annealing:
Carbolite CTF18300 Tube Furnace: Inert/forming gas atmospheres, gas flow up to 10 SLM, temperature up to 1750°C, supports substrates up to 75 mm.
Thermco Minibrute Tube Furnace: Gas flow up to 7 SLM, temperatures up to 1000°C, supports substrates up to 4" diameter.
AGA Heatpulse 610 Rapid Thermal Annealer (RTA): Inert atmosphere processing up to 1300°C, ramp rates up to 200°C/s.
The Cleanroom’s advanced metrology tools support detailed characterisation and measurement of materials and devices, ensuring quality control, process optimisation and precision characteristics.
Optical Microscopy:
Polylite Optical Microscopy: Features image capture and measurement capabilities.
Film Measurement:
Rudolph Inc Ellipsometer: Measures refractive index and thickness of transparent films.
Surface Profiling:
Ambios XP100 Stylus Profiler: For detailed surface topography.
Electrical Characterisation:
Wentworth Probe Station with Agilent B1500A: For parameter analysis.
SemiProbe Semi-Automated Probe Station with Keysight B1505A: Power device analysis.
Materials Development Corp (MDC) CV Mercury Probe Station: For capacitance-voltage measurements.
Four Point Probe Station: Measures sheet resistance.
