Work Package Leads
Dr. Peter Gammon, University of Warwick, is the Project Coordinator as well as the lead of the Fabrication team. He is an Associate Professor and Royal Academy of Engineering (RAEng) Research Fellow in the School of Engineering at the University of Warwick. Since 2008, he has published more than 25 journal papers with a total of over 200 citations, and over 20 peer reviewed conference papers. He graduated with a 1st class MEng honours in Electrical and Electronic Engineering from Warwick in 2006, before completing a PhD at Warwick in 2011 under Prof. Phil Mawby. He is the principal investigator in three major grants from the RAEng, the EPSRC (EP/N00647X/1) and H2020 (the SaSHa project), all looking into developing new electronic devices that can work in the ‘harsh’ environment, where reliability and efficiency must be maintained despite operating in extreme surroundings. His other research interests include SiC and GaN power electronic devices, electrical characterisation techniques and rectenna devices.
Dr. Tanya Trajkovic, Cambridge Microelectronics, is the lead of the device Simulation work package. She is an experienced technical project manager with extensive expertise in device design, TCAD simulations, device characterisation and optimisation for high yield and reliable operation. She has more than 15 years of experience in development of high voltage lateral power devices and Power ICs as well as vertical IGBTs rated up to 6.5kV. She has received PhD in High Voltage Power devices from Cambridge University after which she worked in Camsemi for 10 years. She is the inventor of 9 patents and patent applications and author of more than 40 technical papers. She is also a member of the technical committee of the leading international symposium on High Voltage Semiconductors, the ISPSD. She has a proven record in taking new technologies and product ideas from concept through qualification to volume manufacturing. She has experience with academic and commercial environments, small and dynamic start-ups and multinational companies.
University of Warwick
Fan Li (Device fabrication researcher)
Chunwa Chan (Device simulation researcher)
Prof. Phil Mawby (Project consultant)
Prof. Julian Gardner (Project consultant)
Dr. Pathirna Vasantha (Device simulation researcher)
Dr. Nishad Udugampola (Device simulation researcher)
Dr. Gianluca Camuso (Device simulation researcher)
Prof. Florin Udrea (Project consultant)
Dr. Valeria Kilchytska, Université Catholique de Louvain, takes the lead in the Reliability work package, mainly on the radiation characterisation. She received her MSc in solid-state electronics and Ph.D. degree in semiconductor and dielectric physics from Kiev Shevchenko University, Kiev, Ukraine. In 2002, she joined UCL, Microelectronics Laboratory. She has a long-term experience in advanced device characterization focused on wide frequency band characterization, simulation and performance assessment from one side and on the investigation of wide-temperature range behavior and radiation effects particularities of advanced devices from another side. She has been a principal investigator of numerous research projects funded by regional and European institutions. She has authored or co-authored about 200 technical papers and conference contributions. She also serves as a reviewer for various international journals and conferences such as IEEE TED, IEEE EDL, Solid State Electronics, a TPC member of several international conferences and a member of working group on creation of European Innovative Nanoelectronics Infrastructure.
Dr. Farzan Gity, Tyndall National Institute, deals with high quality Si/SiC Materials preparation in SaSHa project. He received the PhD degree in Electrical and Electronics Engineering from University College Cork (UCC). He is a research scientist at the Micro/Nano-electronics Centre at Tyndall National institute. During his PhD he developed Ge-to-Si integration by direct wafer bonding and layer exfoliation (Smart-cut approach). He was also able to develop the process of transferring a thin film of Ge to Si by low temperature direct bonding followed by etch-back process optimisation. Ge/Si photodetectors were fabricated showing remarkably high responsivity. This has led to a US patent application. During his post-doc at Tyndall, Farzan developed an approach to transfer red micro-LEDs from GaAs substrate onto glass by wafer bonding through an Innovation Partnership project funded jointly by Enterprise Ireland and an industrial partner. He is the recipient of the 2013 UCC post graduate bursary award (BOC) for his PhD thesis work on Ge-to-Si integration by wafer bonding. He also acts as a reviewer for various journals such as APL, JAP, IEEE TED, and IEEE EDL.
Université Catholique de Louvain
Prof. Denis Flandre (Project consultant)
Tyndall National Insititute
Dr. Graeme Maxwell (Project consultant)