Etching and Wet Processing
The cleanroom is equipped to perform etch removal processes using acid (wet etch) and plasma (dry etch) techniques. The facility is also equipped for other wet processing, such as wafer cleaning.
Wet Etching
- Full range of wet chemistries for etching and cleaning semiconductor, metal and ceramic materials.
- Standard acids: hydrochloric acid, nitric acid, hydrofluoric acid, sulfuric acid.
- Standard alkalis and oxidisers: ammonium hydroxide, tetramethylammonium hydroxide (TMAH), hydrogen peroxide.
- Hot plate and water baths available for heated processes, e.g. RCA SC-1 and SC-2.
Dry Etching
- Corial 200IL ICP dry etch system incorporating fluorinated and chlorinated chemistry. Integrate laser end point detection (EPD) for etch monitoring.
Other Wet Processing
- Type 1 (18.2MΩ) DI water in all wet stations.
- Two extracted cabinets for solvent cleaning and lift off processes.
| Henniker plasmaHPT-100 tabletop Plasma Systemis suitable for routine surface cleaning and activation for a wide range of materials. It features precision mass flow controlled gas inlet, touch-screen interface and robust and reliable 40kHz (100W) plasma generator with fully variable power delivery. Extremely simple to use with front panel touch interface providing interlocked pump down, process and vent cycles. |
 |
A new user training: Mike Crosby and Alan Burton
Technical support: Mike Crosby and Alan Burton
Risk assessment