Lithography
Within the cleanroom is a 40 m2 lithography area, illuminated with yellow light to enable the use of photoresist. Positive and negative photoresists are used in the laboratory, which is also equipped for bi-level resist processes.
Coating
In the School of Engineering
- Laurell WS-650Mz-23 spin coater. Used for applying photoresist to samples from the liquid phase.
- Accepts wafers up to 150mm (6") and small samples down to <1cm2.
- Cleanliness: excellent. Dedicated to conventional photoresists.
- Standard primer: hexamethyldisilazane (HMDS).
- Standard photoresists:
- Positive: S1818
- Image reversal: AZ 5214-E
- Negative: AZ nLOF 2035
- Other photoresists available on request.
- Standard dielectrics: polyimide.
- Dedicated spin-coater for clean processes & high-resolution lithography.
- Example applications: power MOSFET gate, source & JTE patterns, electrode patterns, encapsulant dielectric.
- Laurell WS-650Mz-23 spin coater. Allows coating from the liquid phase for materials such as SU-8 photoresist.
- Accepts wafers up to 150mm (6") and small samples down to <1cm2.
- Cleanliness: good. Supports materials with modest solvent soluability, such as SU-8 photoresist.
- Standard primer: hexamethyldisilazane (HMDS).
- Standard photoresists: SU-8. Other photoresists available on request.
- Flexible spin coater, supporting materials with poor compatibility with high-resolution photolithography.
- Example applications: microfluidic structures.
In the Department of Physics
- Laurell WS-650Mz-8NPPB spin coater. Used for applying photoresist to samples from the liquid phase.
- Accepts wafers up to 150mm (6") and small samples down to <1cm2.
- Cleanliness: good.
- Standard primer: hexamethyldisilazane (HMDS).
- Standard photoresists:
- Positive: AZ ECI 3007
- Image reversal: AZ 5214-E
- Other photoresists available on request.
- Spin coater for direct write lithography. Typically uses thinner photoresists than contact photomask processes in School of Engineering.
- Example applications: electrode patterns.
Exposure
In the School of Engineering
- SUSS MicroTec MA8/BA8 mask aligner. Semi-automated workhorse tool for mask alignment and UV exposure.
- Accepts wafers up to 200mm (8") and small samples down to <1cm2.
- Cleanliness: excellent. Dedicated to conventional photoresists.
- Minimum resolution: 0.75µm approx.
- Extended capability: back-side alignment, auto-alignment.
- Core mask aligner tool. User-friendly, high throughput, high flexibility for both large and small samples.
- Example applications: power MOSFET gate, source & JTE patterns, large-area lithography.
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SUSS MicroTec MJB4 manual mask aligner. Manual mask aligner offers increased flexibility.
- Accepts wafers up to 75mm (3") and small samples down to <1cm2.
- Cleanliness: excellent.
- Minimum resolution: 0.75µm approx.
- Manual mask aligner better supports process variations and creative applications.
- Example applications: photomasks carrying multiple patterns, small samples.
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SUSS MicroTec MJB3 manual mask aligner. Manual mask aligner for non-standard processes.
- Accepts wafers up to 75mm (3") and small samples down to <1cm2.
- Cleanliness: good. Highly flexible platform.
- Minimum resolution: 1.5µm approx.
- Flexible mask aligner, supporting materials with poor compatibility with high-resolution photolithography.
- Example applications: microfluidic structures.
- SUSS MicroTec MA8/BA8 substrate conformal imprint (SCIL, also known as nano-imprint) function. Pattern transfer from stamp to resist to achieve nano-scale features with high throughput.
- Accepts wafers up to 75mm (3").
- Cleanliness: excellent.
- Minimum resolution: 50nm approx.
- Patterning technology for nano-scale features without e-beam lithography. Capable of large-area patterning with rapid turnaround.
- Example applications: nano-antenna structures.
In the Department of Physics
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Heidelberg Instruments μPG 101 laser writer. Direct write of pattern into conventional photoresist using UV laser.
- Accepts wafers up to 150mm (6") and small samples down to <1cm2.
- Cleanliness: good.
- Minimum resolution: 0.6µm approx.
- Direct write of pattern files to sample, eliminating lead time and cost for photomasks.
- Example applications: electrode patterns, photomask fabrication.
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UWAVE UV chamber with UV LED source. Flood exposure chamber for single-stage processes.
- Accepts wafers up to 200mm (8") and small samples down to <1cm2.
- Cleanliness: good.
- Minimum resolution: 1.5µm approx.
- For single-stage lithography processes which do not need alignment, plus flood exposure. Continuously variable exposure power and time.
- Example applications: image reversal processes, single-stage exposure.
Develop
In the School of Engineering
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Manual wet bench for photoresist developing. Petri dish glassware supports a wide range of sample and wafer sizes.
- Accepts wafers up to 150mm (6") and small samples down to <1cm2. Other sizes available on request.
- Cleanliness: excellent.
- Standard developers: MF-319, AZ 726 MIF. Other developers available on request.
- Standard removers: acetone, isopropanol. Other removers available on request.
- Type 1 (18.2MΩ) DI water available for rinse and dilution.
- Maximum flexibility for a wide range of photoresist chemistries and sample types. Laurell EDC-650Hz spin developer also available for 2-3" diameter substrates.
- Example applications: MOSFET fabrication, microfluidics, electrode patterns.
In the Department of Physics
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Manual wet bench for photoresist developing. Beakers and glassware support a range of sample and wafer sizes.
- Accepts wafers up to 100mm (4") and small samples down to <1cm2. Other sizes available on request.
- Cleanliness: good.
- Standard developer: AZ 326 MIF. Other developers available on request.
- Standard removers: Technistrip, acetone, isopropanol. Other removers available on request.
- DI water available for rinse and dilution.
- Focused on small sample sizes, high flexibility.
- Example applications: electrode patterns.
