Power Electronics Facility - Electronic Device Assembly and Packaging
The Power Electronics Reliability Facility supports the development and prototyping of advanced electronic assemblies, enabling precise placement and bonding of semiconductor devices for research and development. The equipment is funded through Innovate UK's Driving the Electric Revolution programme.
Equipment
- High-Precision Die Bonder: The FINEPLACER® lambda 2 from Finetech is a high-precision die bonder enabling sub-micron placement of SiC and GaN devices. It supports adhesive, soldering, thermocompression, and ultrasonic bonding with precise force and temperature control, for prototyping, process development, and scalable manufacturing.
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Large Wire Bonder: The Orthodyne Model 20 is a manual ultrasonic wedge bonder for aluminium wires (4–20 mil) used in power devices. It enables reliable high-current interconnections with precise control of bonding parameters, supporting assembly, prototyping, and evaluation of power semiconductor packages.
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Reflow Oven: The SRO 704 enables controlled thermal processing up to ~400 °C, with programmable temperature, nitrogen flow, vacuum, compressed air, and formic acid atmosphere. It supports soldering and silver sintering, providing uniform heating for die attach, packaging, and prototyping of power electronic devices.
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Bond Shear & Pull Tester: The Nordson DAGE Stellar 4000 enables shear and pull testing of semiconductor interconnections, with forces up to 100 kg (shear) and 10 kg (pull). It features an XY stage with 100 × 100 mm travel. It provides controlled force application and precise
Capabilities
- Prototype device assembly
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Packaging process development
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Alignment and bonding validation
Applications
- Power semiconductor packaging
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Device prototyping
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Sensor and MEMS assembly
Related capabilities
Contact
Claire Gerard: / 07385 145064