Please see below details of exhibitors who are confirmed for ECSCRM 2018:
Exhibition opportunities still available - see here!
A-Z list of exhibitors:
Centrotherm has been developing and realizing innovative thermal solutions for over 60 years. As a leading and globally operating technology group, we offer production solutions for the semiconductor and microelectronic industries.
Our equipment is designed for all needs from R&D to mass production and applicable for various semiconductor technologies and applications, such as logic and memory devices (e.g. Flash, DRAM) power semiconductors (e.g. Si, SiC), LED, SMT, MEMS or sensor technology: The product portfolio comprises horizontal and vertical batch furnaces (atmospheric or vacuum processes), vertical high temperature furnaces (annealing < 2000Â°C, oxidation < 1500Â°C), single wafer systems < 300mm wafer diameter (RTP, low-temperature microwave oxidation).
The Fraunhofer Institute for Integrated Systems and Device Technology IISB conducts applied research and development in the fields of power electronics, mechatronics, microelectronics and nanoelectronics. IISB is the leading Fraunhofer institute for SiC research and development in Germany and has been cooperating with international partners for more than 20 years. IISB is offering internationally recognized expertise in terms of SiC services and contract research from materials development and characterization, device manufacturing to module assembly and power electronic systems. IISB operates the P-Fab which is dedicated to technology development and prototype device fabrication on Si and SiC wafers.
Freiberg Instruments is one of the fastest growing, young and dynamic analytical instrumentation companies with products and service covering industries like Crystal Growth & Processing, Microelectronics, Photovoltaic and Research & Development. Key products include: Single crystal diffractometer (XRD), automated sorting and stacking devices, electrical semiconductor characterization devices - ÂµPCD/MDP (QSS)
With tighter design limits and the escalating need to increase yield and reduce semiconductor manufacturing costs, automated defect inspection to detect and classify defects in compound semiconductor processing is more critical than ever. KLA-Tencor's Candela semiconductor inspection tool combines the elemental principles of scatterometry, ellipsometry, reflectometry, and topographical analysis to detect defects and then to classify defects in substrates, epi-layers, and process films. Candela semiconductor inspection technology is being used to detect and classify defects by industry leaders in Power Device, LED and GaAs, industries to monitor production lines, detect mission-critical defects of interest, and create process-specific recipes to detect and classify killer defects while ignoring nuisance defects.
NuFlare’s SiC Epitaxial System EPIREVO™ S6 is based on the same concept and key features as NuFlare’s Si technology (HT2000FD). These key features consist of Vertical Gas Flow, High Speed Wafer Rotation, Direct Wafer Temperature Measurement, and Multi Zone Controlled Solid Heater. With the combination of vertical gas flow and high speed rotation, EPIREVO™ S6 forms an ultra-thin and uniform concentration boundary layer. The boundary layer becomes thinner as the rotation speed increases. The growth rate increases with the rotation speed as the source gas diffusion rate is accelerated by the thinner boundary layer
Demand for SiC substrates is growing as the demand for SiC-based power and RF devices increases. Yet the adoption of SiC is slowed by cost and by the difficulty of processing the material.
Revasum has developed a streamlined grind and CMP process that eliminates conventional lapping and diamond polishing steps and the associated issues. Revasumâ€™s solution reduces the overall cost to manufacture SiC substrates, in addition to improving quality, productivity and yield -- removing two barriers to more rapid growth in demand for SiC.
Rigaku is a pioneer and world leader in designing and manufacturing X-ray based measurement tools to solve semiconductor manufacturing challenges since its inception in 1951. Rigaku specializes in making TXRF to measure surface metal contamination and X-Ray Topography to analyze crystal dislocations. Also, we offer XRF, XRD and XRR metrology tools to measure critical process parameters like thin film: thickness, composition, roughness, density, porosity, and crystal structure.
Products；XRTmicron (X-ray Topography), TXRF3760/3800e, AZX400&3650 (XRF）
Semiconductor Technology Research (STR) provides software and consulting services for development and optimization of industrial growth equipment, improvement of bulk growth (solution growth, PVT, CVI) and epitaxial techniques, engineering of modeling of following applications: modeling of bulk crystal growth, CVD SiC,coating processes. Offered software products include thesemiconductor devices, MOVPE and HVPE of Group-III nitrides, III-V materials and their alloys; simulation of semiconductor devices.
Showa Denko provides high-quality grade silicon carbide epitaxial wafers (HGE) for high power devices in both 4'' and 6''.
As a leading global supplier of semiconductor and flat panel display (FPD) production equipment, Tokyo Electron Limited (TELâ„¢) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL's semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network of approximately 74 locations in 16 countries and regions in the U.S., Europe, and Asia.
Toray Research Center, Inc. provides you with analysis services using a variety of techniques. Our superior ability to meet the problem-solving requirements of clients is based on a long track record and extensive experience in analysis and material evaluation. We will show you our analytical techniques and some examples of our application results.