Failure analysis: The cutting-edge techniques that can detect material defects and improve product performance
Advancements in material analysis techniques are continually expanding our ability to create high performance materials and components.
Cutting-edge techniques such as electron microscopy, photoemission spectroscopy, and X-ray computed tomography (XCT) are instrumental in helping to understand and prevent material failures, optimising product design and driving innovation.
By probing the structure, composition and chemistry of materials, these techniques can reveal crucial information about why a material or component performs in a certain way, enabling engineers and scientists to improve the durability, reliability and safety of products.
Challenges in industry
Failure analysis plays a key role across industries where the reliability and durability of materials is paramount, from aerospace and automotive manufacturing to electronics and power storage. Advanced analytical techniques can be used to detect even the smallest flaws.
Electron microscopy, for example, offers high-resolution imaging ranging from several hundred to several million times magnification. Transmission electron microscopes can reveal atomic-level structures, enabling the identification of microscopic defects.
Photoemission spectroscopy provides detailed information on surface composition and chemistry. By analysing the emitted photoelectrons when a material is exposed to x-rays, it determines chemical composition and bonding environments, which provide key insights into degradation and failure mechanisms. This is particularly important in fields such as electronics and energy storage, where surface chemistry directly impacts performance.
XCT scanning provides non-destructive, 3D images of the internal structure of samples. It can reveal defects, such as voids, cracks, and inclusions that are not visible externally. XCT is widely used in industries such as automotive and aerospace, where the ability to examine components without damaging them is crucial. It can also be used to image samples in dynamic states, revealing degradation or other changes, for example due to force or temperature.
Work with Warwick to help you drive innovation
The University of Warwick’s state-of-the-art Research Technology Platforms (RTPs) are equipped to address a wide array of failure analysis challenges across different sample types and scales.
Electron Microscopy RTP: This facility houses transmission electron microscopes capable of imaging structures at atomic resolution, as well as scanning electron microscopes and atomic force microscopes that can provide detailed surface analysis.
XCT RTP: With five advanced CT scanners, our XCT facility is equipped to handle materials from microelectronics to large metal components. Our ultra-high-resolution system can capture micron-sized features, while our high-power scanner is ideal for larger samples such as engine blocks. The facility also features a high-speed imaging system for dynamic sample analysis.
Photoemission RTP: This facility features the Kratos XPS and Omicron XPS surface analysis systems, providing detailed analysis of surface chemistry and electronic states via x-ray photoelectron spectroscopy (XPS) and ultraviolet photoelectron spectroscopy (UPS).
For further information and detailed specifications of our equipment, visit the RTP webpages.
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Get in touch to discuss how we can help solve your challenges. Contact Claire Gerard, Warwick Scientific Services Manager (
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