The cleanroom is equipped to deposit dielectric and metal films.

 

Dielectric

• Ultratech Fiji plasma-enhanced ALD system. Standard precursors: Al, Si, Zn, Hf. Standard co-reagents: H₂O, O₂ plasma, O₃, N₂ plasma.
• Tetreon (Thermco) LPCVD system incorporating TEOS (Tetraethyl orthosilicate) chemistry allowing the deposition of high quality oxide films from 10-4000nm.
• SVS 8 pocket electron beam evaporator. Integrated ion beam gun for in-situ etch prior and post deposition. Standard dielectrics: Al₂O₃, MgO, SiO₂. Others dielectrics available on request.

 

Metal

• SVS 8 pocket electron beam evaporator. Integrated ion beam gun for in-situ etch prior and post deposition. Standard metals: Ni, Al, Ti, Cr, Pd, Ag, Au, W, Pt. Others metals available on request.